
* Efficient heat conduction and stable temperature control * Strong bonding and anti-aging * Insulation and lightweight design * Can be customized according to specific requirements
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Products Description
Thermally conductive double-sided adhesive tape is an industrial material designed for efficient heat transfer. It solves the problem of overheating of electronic devices by transferring heat from the heat source to the radiator or metal casing. Compared with traditional thermal paste or mechanical fixing methods, thermally conductive tape has both bonding and insulation properties. It is widely used in electronics, automobiles, LED lighting, and other fields. It is an ideal heat dissipation solution for miniaturized and lightweight equipment.
Feature
The thermal conductivity coefficient (Thermal Conductivity) reaches 1.5-3.0 W/m·K, which can quickly transfer the heat generated by components such as chips and batteries, and reduce the operating temperature of the equipment by 20%-35%.
The thermal tape temperature range is 80℃ to 120℃, which can adapt to extreme environments (such as car engine compartments, 5G base stations).


Breakdown voltage > 5kV/mm, ensuring the safety of electronic components.
Thermal adhesive tape thickness of 0.1-0.5mm saves internal space of the device and helps to make the product thinner and lighter.
Product Construction


Physical Properties
| Item | NKS-## | NKS-##N | Test Method |
|
Carrier |
Glass Fabric | N/A | --- |
|
Adhesive |
Thermally Conductive PSA | Thermally Conductive PSA | --- |
| Total thickness(mm) | 0.10~0.50 | 0.05~0.40 | ASTM D374 |
| Color | White | White | VISUAL |
| Release Liner | Blue PE Film | White Release Paper | VISUAL |
|
Adhesion (N/25mm) |
12~18 | 12~18 | PST-101 |
|
Thermal Conductivity(W/m-k) |
1.2 | 1.2 | ASTM D22470 |
|
Voltage Resistance(KV/mm) |
3.5~8.0 | 3.5~8.0 | ASTM D149 |
|
Temperature Resistance(Short Term, ℃/℉) |
120(℃) 248(℉) |
120(℃) 248(℉) |
EN344 |
|
Standard width(mm) |
2~1030(Customized Available) | ||
|
Standard length(m) |
25/50(Customized Available) | ||
Application
Thermally conductive double-sided adhesive tape application field
Consumer electronics heat dissipation
Smartphones/tablets: fix graphite sheets or heat spreaders to reduce CPU temperature.
Laptops: replace heat dissipation silicone grease to improve assembly efficiency.
New energy and automotive electronics
Power battery module: bond battery cells and cooling plates to balance temperature distribution.
On-board charger (OBC): provides heat dissipation and insulation protection for IGBT modules.
Industry and LED lighting
Industrial power supply: reduce transformer temperature rise and extend service life by more than 30%.
High-power LED light strips: avoid light decay and maintain color temperature stability

How To Choose The Right Thermal Tape?
Clear thermal management requirements
Low-power devices (such as routers) can choose products with a thermal conductivity of 1.5-2.0 W/m·K; high-power chips (such as GPUs) need to be ≥2.5 W/m·K.
Focus on the substrate and adhesive layer
Substrate type: Silicone substrate is soft and resistant to bending, while acrylic adhesive has better temperature resistance.
Adhesive thickness: 0.15mm adhesive layer balances adhesion and thermal resistance.
Certification and test report
Prioritize products that have passed ROHS, REACH environmental certification, and UL 94 V-0 flame retardant rating.


| Item | NKS-## | NKS-##N | Test Method |
|
Carrier |
Glass Fabric | N/A | --- |
|
Adhesive |
Thermally Conductive PSA | Thermally Conductive PSA | --- |
| Total thickness(mm) | 0.10~0.50 | 0.05~0.40 | ASTM D374 |
| Color | White | White | VISUAL |
| Release Liner | Blue PE Film | White Release Paper | VISUAL |
|
Adhesion (N/25mm) |
12~18 | 12~18 | PST-101 |
|
Thermal Conductivity(W/m-k) |
1.2 | 1.2 | ASTM D22470 |
|
Voltage Resistance(KV/mm) |
3.5~8.0 | 3.5~8.0 | ASTM D149 |
|
Temperature Resistance(Short Term, ℃/℉) |
120(℃) 248(℉) |
120(℃) 248(℉) |
EN344 |
|
Standard width(mm) |
2~1030(Customized Available) | ||
|
Standard length(m) |
25/50(Customized Available) | ||
Notice: The above were reference values. For detailed information, please contact HONGFU.
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